Intel Corporation and United Microelectronics Corporation (UMC), a leading global semiconductor foundry, announced a strategic collaboration. They will jointly develop a 12-nanometer semiconductor process platform to address high-growth markets.
This partnership brings together Intel’s at-scale U.S. manufacturing capacity and UMC’s extensive foundry experience on mature nodes. It enables an expanded process portfolio and offers global customers greater choice in their sourcing decisions.
The production of chips at this 12-nm node will begin at Intel’s Fabs 12, 22, and 32 in Arizona in 2027. Intel claims that 90% of the tools have been transferable between 10-nm and 14-nm nodes.
United Microelectronics (UMC) is a leading global semiconductor foundry company. The company provides high-quality IC fabrication services, focusing on logic and various specialty technologies to serve all major sectors of the electronics industry.
The partnership could reshape the semiconductor industry by reducing costs, enabling UMC’s entry into the FinFET market, and enhancing Intel’s foundry model transition. This could potentially impact TSMC’s market dominance.
The collaboration could be a game-changer for both companies, potentially reshaping the semiconductor industry. It could also diversify the semiconductor supply chain, preventing potential future pandemics or geopolitical issues.
59%
Samsung Foundry
13%
UMC
6%
As of December 12, 2023
Despite the announcement of the partnership, UMC’s shares tumbled 4.78 percent. However, analysts believe that the benefits from the Intel partnership aren’t fully priced in yet.
Intel and UMC will jointly offer EDA tools, IP offerings, and process design kits (PDKs) to simplify the 12-nm deployment for chip vendors. The 12-nm process node will be built on Intel’s FinFET transistor design, and the two companies will jointly share the investment.
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